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If you wish to increase the accuracy, you can also use the “dbu” function to set a smaller computationĭatabase unit. That implies that the accuray can be increased by using a smaller database unit for the input layout. The minimum value recommended is 2 database unit.
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With the desired delta value in micrometer units. To modify the value, call the “delta” function The default value of “delta” is 10 database units. Threshold, so shapes or gaps smaller than this value cannot be produced. In addition, healing or small gaps and slivers during the processing uses the delta value as a dimension Will basically determine that accuracy level and in some cases, for example the sheet thickness Is an accuracy limit for the creation or modification or geometrical regions. delta methodĭue to limitations of the underlying processor which cannot handle infinitely thin polygons, there If the database unit should is made too small, coordinate overflow may happen. It’s recommended to put a DBU modication statement before all other statements in the script. Every call of “bulk” will return a fresh object, so the object needs to be stored in a variable for later use: This object can be used to represent the unmodified wafer substrate and can be target of etch operations. This methods returns a material data object which represents the wafer at it’s initial state. All functions accept a value in micrometer units. The parameters can be modified with the respective functions. For backside processing, “depth” also defines the wafer thickness. Etching cannot happen deeper than “depth”. Material cannot grow outside the space above or below the wafer. The material operations a performed in a limited processing window, which extends a certain height over the wafer top surface (“height”), covers the wafer with a certain depth (“depth”) and extends below the wafer for backside processing (“below” parameter). It’s used as seed for the global etch and grow function only. This method delivers a mask data object which covers the whole wafer.
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Outputs a material object to the output layout This is the starting point for structured grow or etch operations. lyp layer properties file to be used on the cross-section layoutĭesignates the layout_data object as a litho pattern (mask). Returns a layer data object.Ĭonfigures a. Equivalent to all.etch(…)Ĭonfigures the computation margin (see below)Ĭonfigures the height of the processing window (see below)įetches an input layer from the original layout. Gives a material data objectĬonfigures the depth of the processing window or the wafer thickness for backside processing (see below) The following standalone functions are available: FunctionĬonfigures the lower height of the processing window for backside processing (see below)Ī pseudo-material describing the wafer bodyĬonfigures the computation database unit (see below)Ĭonfigures the accuracy parameter (see below)ĭeposits material as a uniform sheet.